ORGANOSILICASOL is colloidal silica dispersed in various organic solvents.
It can be mixed into resin systems to improve functionality such as hardness, electrical insulation, CTE reduction, anti-scratch and abrasion resistance.
ORGANOSILICASOL product list
- Colloidal silica dispersed in hydrophilic solvents
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Particle size by BET method. The figures above are general properties, not guaranteed properties.
For your desired specification such as s olvent and surface treatment, feel free to contact us.
- Colloidal silica dispersed in hydrophobic solvents
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Particle size by BET method. The figures above are general properties, not guaranteed properties.
For your desired specification such as solvent and surface treatment, feel free to contact us.
- Colloidal silica treated by special modifier
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Particle size uses BET method. The figures above are general properties, not guaranteed properties.
For your desired specification such as solvent and surface treatment, feel free to contact us.
Functionality and applications of ORGANOSILICASOL
- Hydrophilic contribution
- Improved wetting characteristics are obtained by Si-OH group and absorbed water.
- Preferred grades
Small particles / Hydrophilic solvent type -
- Applications
- Coating on optical films
- Coating on glass and films
- Anti-blocking
- Silica particles can make nano-sized concavity and convexity on the surface of films.
- Preferred grades
Large particles / Standard grades
- Hardness
- Nano silica is used to significantly improve hardness and anti-scratch performance of resin.
- Preferred grades
Small particles / Surface modified grades
- Curl control
- Nano silica contributes to curl control of resin.
- Preferred grades
Small particles / Standard grades -
- Applications
- Coating on optical films
- Coating on variou films
- High transparency
- Transparency of films or composites can be kept due to nano particle.
- Preferred grades
Small particles
- Low CTE
- Adding silica contributes to lowering CTE of resin or film.
- Preferred grades
All grades -
- Applications
- Encapsulation material, Adhesive material, Multilayer printed circuit board
- Electrical insulation varnish
- High insulation property
- Electrical insulation property of resin is improved by adding nano silica.
- Preferred grades
Small particles -
- Applications
- Electrical insulation varnish
- Physical strength
- Physical strength and modulus of resin is improved by adding nano silica.
- Preferred grades
Surface modified grades -
- Applications
- Additive in films, Adhesive material
- Electrical insulation varnish
- Abrasion
- Spherical and hard particles can work for smooth polishing.
- Preferred grades
Combination of several particles -
- Applications
- Polishing tape
- Resin flow control
- Resin flow can be improved by adding nano silica with submicron silica.
- Preferred grades
Surface modified grades -
- Applications
- Encapsulation material, Adhesive material
Characteristic of ORGANOSILICASOL
TEM image
- Particle size：12nm
- Particle size：45nm
- Particle size：80nm
- Particle size：12nm Chain
How to use ORGANOSILICASOL
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- When use ORGANOSILICASOL, refer to a below procedure to avoid particles aggregation.
- 1. Pour ORGANOSILICASOL into vessel firstly.
- 2. Add solvent, resin and additives to ORGANOSILICASOL with stirring.
