Our silica sol is used for semiconductor encapsulation material to reduce CTE.
Rheology control is possible when nano silica is used with micron or submicron silica.
Silica sol is expected to be applied for encapsulation of LED, adhesive film, multilayer printed circuit board and flexible display.
Resin flow control
- Epoxy resin flow can be improved by substituting nano silica for small portion of submicron silica.
- Resin flow is improved
because nano particles work
as bearing between submicron
particles.
Physical properties of epoxy nano-composites
- Adding nano silica to epoxy resin has an effect on reducing CTE and improving mechanical strength the same as adding submicron silica. The smaller the particle size is, the higher the transparency of epoxy resin is.
Preferred products
It is just an example. Please contact us if you need more detailed information.
